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Estêncil de reballing bga para honor x50 sm6450 snapdragon 6 gen1 cpu ram ddr4x ufs3.1 pm6150c pm6450 pm7250b sdr735 wcn3988 wcd9370

R$ 16,92

Availability: 971 em stock

REF: 1005005900547563
  • Produto Químico de Alta Preocupação: Nenhum
  • Origem: CN (Origem)
  • Número do modelo: 6450
  • Certificação: NONE

Welcome to our store


We specialize in integrated circuit chips


If you need to purchase more models


Click on the“Add To Cart”

• Shipping Information


Items will be ship within3 daysof payment receive.


working days(2-4 weeks)to receive for most area.


If you do not receive item within 30 working days(5 weeks), please contact us to investigate the case.



The soldering process is complicated,oldering/replacing chips must be operated by engineers who have proficient skills.


As BGA chips are fragile, complicatedly structured, with numerous balls
any slightly faulty positioning


careless temperature-control or incomplete cleaning PCB boards will result in insufficient soldering or missing soldering.


BGA chips are easily get broken by improper soldering. Before buying, you should consider 3 points:


1) Have you bought the right chips?


2) Do you have proper equipment?


3) Are you skillful enough to solder the chips?


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